Products
Professional Use
Thermal Curing One-Component Epoxy Adhesive for Underfill
Thermal curing one component epoxy adhesive with excellent flow.
Features
Excellent Capillary Flow
Low viscosity and excellent flow characteristics.
Ideal for underfill and side fill applications, particularly for flip chips.
Low Temperature Curing
Low temperature and short time curing, suitable for heat sensitive parts and materials.
Product Description
| Product Name | AY-5218C |
|---|---|
| Application | Underfill / side fill |
| Features | Low Viscosity |
| Specific Gravity | 1.2 |
| Curing Time | 10min / 100℃ |
| Appearance | Black |
| Viscosity (m㎩・s) | 1250 |
| Hardness (Shore D) | 70 |
| Elastic Modulus (G㎩) | 1.3 |
| Tg (℃) | 36 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 80 |
| Tensile Shear Strength (N/㎟) | 20 |
| Temperature Range (℃) | ～150 |
| Volume | 250g |
| Pot Life at 25℃ (day) | 10 |
| Storage Conditions | Frozen |
