Products
Professional Use
Thermal Curing One-Component Epoxy Adhesive for Motor Magnet Bonding
Designed for applications requiring thermal resistance and high strength.
Features
Excellent Thermal Resistance
Ideal for bonding applications requiring heat resistance and strength, such as motor magnets and potting of electronic components.
Product Description
| Product Name | AY-5011 | AY-5259 |
|---|---|---|
| Application | Motor Magnet Potting |
Automotive Motor Epoxy Wafer Lens Encapsulation Potting |
| Features | High Strength Heat Resistance High Viscosity |
High Tg, Heat Resistance High Hardness |
| Specific Gravity | 1.2 | 1.5 |
| Curing Time | 60min / 120℃ | 60min / 120℃ |
| Appearance | Gray | Black |
| Viscosity (m㎩・s) | 120000 | 6000 |
| Hardness (Shore D) | 87 | 91 |
| Elastic Modulus (G㎩) | 2.4 | 8.4 |
| Tg（℃） | 155 | 191 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 65 | 35 |
| Tensile Shear Strength (N/㎟) | 29 | 15 |
| Temperature Range (℃) | ～180 | ～190 |
| Volume | 250g | 250g |
| Pot Life at 25℃ (day) | 30 | 1 |
| Storage Conditions | Frozen | Frozen |
