Thermal Curing One-Component Epoxy Adhesive for Motor Magnet Bonding
Professional Use

Thermal Curing One-Component Epoxy Adhesive for Motor Magnet Bonding

Product line:
One-Component Epoxy Adhesive, Anaerobic Adhesive, and Light-Curing Adhesive
Features:
Thermal ResistantLow HalogenPottingAutomotive ApplicationElectronics ApplicationThermal Curing

Designed for applications requiring thermal resistance and high strength.

Features

Excellent Thermal Resistance

Ideal for bonding applications requiring heat resistance and strength, such as motor magnets and potting of electronic components.

Product Description

Product Number AY-5011 AY-5259
Application Motor Magnet / Potting Automotive Motor / Epoxy Wafer Lens / Encapsulation / Potting
Features High Strength / Heat Resistance / High Viscosity High Tg, Heat Resistance / High Hardness
Specific Gravity 1.2 1.5
Curing Time 60min / 120℃ 60min / 120℃
Appearance Gray Black
Viscosity (m㎩・s) 120000 6000
Hardness (Shore D) 87 91
Elastic Modulus (G㎩) 2.4 8.4
Tg(℃) 155 191
Coefficient of Thermal Expansion (before Tg) (ppm) 65 35
Tensile Shear Strength (N/㎟) 29 15
Temperature Range (℃) ~180 ~190
Volume 250g 250g
Pot Life at 25℃ (day) 30 1
Storage Conditions Frozen Frozen