Products
Professional Use
Thermal Curing One-Component Epoxy Adhesive for Camera Modules
A heat-curing, 1K epoxy resin adhesive with a low curing temperature and short curing time.
Features
For Bonding Heat-Sensitive Components
Ideal for devices such as camera modules, where high temperatures cannot be applied during the curing process.
Product Description
| Product Name | AY-5231 | AY-5274 | AY-5404 |
|---|---|---|---|
| Application | Camera Module Heat Sensitive Device |
Camera Module Heat Sensitive Device |
Camera Module Heat Sensitive Device Potting |
| Features | Instant Curing at Low Temperatures Low Viscosity |
Instant Curing at Low Temperatures Medium Viscosity |
Instant Curing at Low Temperatures High Viscosity |
| Specific Gravity | 1.2 | 1.2 | 1.5 |
| Curing Time | 20min / 80℃ | 20min / 80℃ | 15min / 80℃ |
| Appearance | Black | Black | Black |
| Viscosity (m㎩・s) | 1500 | 4000 | 10000 |
| Hardness (Shore D) | 75 | 78 | 71 |
| Elastic Modulus (G㎩) | 3.7 | 3.4 | 7.8 |
| Tg (℃) | 43 | 56 | 43 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 55 | 70 | 40 |
| Tensile Shear Strength (N/㎟) | 25 | 21 | 22 |
| Temperature Range (℃) | ～150 | ～150 | ～150 |
| Volume (g) | 250 | 250 | 250 |
| Pot Life at 25℃ (day) | 10 | 10 | 10 |
| Storage Conditions | Frozen | Frozen | Frozen |
