Products
Professional Use
Thermal Curing One-Component Epoxy Adhesive for General Bonding
The lower curing temperature and the shorter curing time than the standard thermal curing epoxy adhesives.
Features
For Bonding Various Substrates
Ideal for metal, glass, plastics.
Product Description
| Product Number | AY-5302 |
|---|---|
| Application | General Bonding |
| Features | Standard Product Line |
| Specific Gravity | 1.2 |
| Curing Time | 30min / 100℃ |
| Appearance | Gray |
| Viscosity (m㎩・s) | 5000 |
| Hardness (Shore D) | 83 |
| Elastic Modulus (G㎩) | 3.1 |
| Tg（℃） | 108 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 60 |
| Tensile Shear Strength (N/㎟) | 23 |
| Temperature Range (℃) | ～150 |
| Volume | 250g |
| Pot Life at 25℃ (day) | 30 |
| Storage Conditions | Frozen |
