Products
Professional Use
Hybrid Curing Adhesive
Combines the fast curing properties of light-curing adhesives with the high strength of epoxy resins.
Features
UV Curing and Thermal Curing
After UV exposure for temporary fixation, final strength is achieved through thermal curing.
Form Retention during Thermal Curing
A typical drawback of thermal curing adhesives is that their viscosity decreases as the temperature rises, causing the material to lose its shape and flow during the curing process.
ALTECO's hybrid adhesive minimizes deformation during heat curing by initiating light curing beforehand, which stabilizes the shape.
Product Description
| Product Number | AY-4112 |
|---|---|
| Application | Potting / Molding |
| Features | B-staged by UV energy and fully cured by heat |
| Specific Gravity | 1.2 |
| Curing Time | 100mW/㎠ × 10sec ＋ 1h/80℃ |
| Appearance | Pale Brown |
| Viscosity (m㎩・s) | 3000 |
| Hardness (Shore D) | 80 |
| Elastic Modulus (G㎩) | 2.8 |
| Tg（℃） | 79 / 149 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 80 |
| Tensile Shear Strength (N/㎟) | 17 |
| Temperature Range (℃) | ～150 |
| Volume | 250g |
| Pot Life at 25℃ (day) | 10 |
| Storage Conditions | Frozen |
