Fast Curing Epoxy Resin Adhesive in Cartridge
Professional Use

Fast Curing Epoxy Resin Adhesive in Cartridge

Product line:
Two-Component Epoxy Adhesives for Industrial & Civil Engineering
Features:
General PurposePottingThixotropicCivil Engineering & ConstructionCartridge FilledNo Weighing BeforeUse

In addition to on-site repairs such as fixing tactile paving studs and filling cracks, the product is also suitable for bonding construction materials like metal and wood, as well as repairing flooring and wall surfaces.

Features

MAZERUN 300T

・User-friendly cartridge for easy application.
・No need for manual measuring or mixing, contributing to reduced work time.
・The base resin and hardeners can be mixed easily and accurately.
・Fast-curing adhesive, injection, and filling compound that bonds strongly and quickly to a wide range of materials, including metal, wood, electrical equipment, concrete, and plastics.
・Especially effective for urgent repair, bonding, or filling purposes.
・Solvent free - no volatile components.
・Minimal shrinkage after curing.

Low VOC / Formaldehyde Emission
Compliant with JAIA F★★★★ and 4VOC standards – Japan’s strictest safety criteria for indoor air quality.
Suitable for use in living spaces requiring low chemical emissions.

Typical Applications

・Repair and bonding of tactile indicators, anti-slip materials, and other anchor pins. 
・Repair during on-site such as sealing and crack filling.
・Bonding and fixture of building materials such as metal and wood.
・Repair, bonding, and fixture of flooring and wall materials.
・Repair and bonding of car stops, marble, bricks, and blocks.
・Insulating bonding and fixture of various electronic components such as magnets.  
・Repair of sports equipment such as skis, rackets, and golf clubs.
・For any application requiring quick adhesion.

Properties

MAZERUN 300T
Base Resin Hardener
Main Component Modified Epoxy Resin Modified Thiol
Appearance White Paste Black Paste
Specific Gravity (Mixed) 1.10±0.10
Mixing Ratio (by Volume) 100:100
Pot Life at 20℃ 10min (10g)
Curing Time at 20℃ 24h

Bond Strength

Substrate Unit Tensile Shear Test Procedure
Steel / Steel N/㎟ ≧14 JIS K 6850
Copper / Copper N/㎟ ≧14 JIS K 6850
Stainless Steel / Stainless Steel (SUS304) N/㎟ ≧12 JIS K 6850
Plywood / Plywood N/㎟ ≧7 (Material failure) JIS K 6850
Hinoki / Hinoki N/㎟ ≧4 (Material failure) JIS K 6850