Professional Use

Thermally Conductive Two-Component Epoxy Adhesive

Product line:
Two-Component Epoxy Adhesives for Industrial & Civil Engineering
Features:
PottingHeat ResistanceThermal ManagementFrame RetardantThixotropic

The epoxy adhesive formulated with a high-performance epoxy resin base, offering excellent adhesion, mechanical properties, and enhanced thermal conductivity.

Features

7021

Excellent thermal conductivity.
Siloxane free - no contact failure.

7037

Higher thermal conductivity than 7021.
Siloxane free - no contact failure.

Product Description

    
Product Number7021 7037
Base Resin Hardener Base Resin Hardener
Appearance Gray White White White
Main Component Modified Epoxy Resin Modified Polyamine Modified Epoxy Resin Modified Polyamine
Viscosity (m㎩・s/25℃) 100000 95000 Putty Putty
Specific Gravity 2.8 2.7 3.0 3.0
Mixing Ratio 100:100 100:100
Curing Time (RT) 24h 24h
Thermal Conductivity (W/m·K) 2.1 3.7
Surface Resistivity (Ω·cm) >1014 >1014
Volume Resistivity (Ω·cm) >1014 >1014
Dielectric Constant 1M㎐:4.5 1M㎐:5.3
Dissipation Factor 1M㎐:0.009 1M㎐:0.014
Hardness (Shore D) 92 92
Tensile Shear Strength (N/㎟) 17 11
Flame Retardancy Complies with UL 94 V-0
Equivalent Flammability Standards
Complies with UL 94 V-0
Equivalent Flammability Standards