Products
Professional Use
Thermal Curing One-Component Epoxy Adhesive for Electronic Components and Devices
Formulated with properties tailored for use in particularly demanding electronic components.
Features
Specific Properties on Demand
Application specific properties on demand, strength, environmental resistance, flexibility.
Product Description
| Product Number | AY-5158 | AY-5455 | AY-5013 |
|---|---|---|---|
| Application | IC Chip Reinforcement | Bonding / Sealing for Automotive Electronic Components | Piezoelectric Element / FCB |
| Features | High Reliability | High Hardness | Flexible / Stress-Relief |
| Specific Gravity | 1.7 | 1.9 | 1.2 |
| Curing Time | 10min / 100℃ | 15min / 110℃ | 15min / 80℃ |
| Appearance | Black | Black | Translucent |
| Viscosity (m㎩・s) | 20000 | 40000 | 1250 |
| Hardness (Shore D) | 79 | 95 | 50 / 80(Shore A) |
| Elastic Modulus (G㎩) | 4.3 | 10 | 12M㎩ |
| Tg（℃） | 64 | 126 | 7 |
| Coefficient of Thermal Expansion (before Tg) (ppm) | 39 | 50 | 70 |
| Tensile Shear Strength (N/㎟) | 24 | 17 | 9 |
| Temperature Range (℃) | ～150 | ～150 | ～120 |
| Volume | 250g | 250g | 250g |
| Pot Life at 25℃ (day) | 1 | 30 | 10 |
| Storage Conditions | Frozen | Frozen | Frozen |
